| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption in TZ Secure OS while loading an app ELF. |
| Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. |
| Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. |
| Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. |
| Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. |
| Information disclosure in Audio while accessing AVCS services from ADSP payload. |
| Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time. |
| Transient DOS while parsing WPA IES, when it is passed with length more than expected size. |
| Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size. |
| Memory Corruption in Core due to secure memory access by user while loading modem image. |
| Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Memory corruption when IPv6 prefix timer object`s lifetime expires which are created while Netmgr daemon gets an IPv6 address. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |
| Information disclosure due to buffer over read in kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile |
